Fengxian Jiao, Sheqin Dong, Bei Yu, Bing Li 0005, Ulf Schlichtmann. Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips. In IEEE International Symposium on Circuits and Systems, ISCAS 2018, 27-30 May 2018, Florence, Italy. pages 1-4, IEEE, 2018. [doi]
@inproceedings{JiaoDY0S18,
title = {Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips},
author = {Fengxian Jiao and Sheqin Dong and Bei Yu and Bing Li 0005 and Ulf Schlichtmann},
year = {2018},
doi = {10.1109/ISCAS.2018.8351101},
url = {https://doi.org/10.1109/ISCAS.2018.8351101},
researchr = {https://researchr.org/publication/JiaoDY0S18},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2018, 27-30 May 2018, Florence, Italy},
publisher = {IEEE},
isbn = {978-1-5386-4881-0},
}