Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding

Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang. Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. International Journal of Computational Engineering Science, 4(2):335-338, 2003. [doi]

Abstract

Abstract is missing.