Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry

Jinwon Joo, Seungmin Cho, Bongtae Han. Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. Microelectronics Reliability, 45(3-4):637-646, 2005. [doi]

Abstract

Abstract is missing.