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Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement

Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo. Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]

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Amadine Jouve

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Y. Sinquin

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Arnaud Garnier

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M. Daval

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Pascal Chausse

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M. Argoud

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N. Allouti

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Laurence Baud

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Jérôme Dechamp

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R. Franiatte

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Séverine Cheramy

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H. Kato

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K. Kondo

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