Chi-Cheng Ju, Tsu-Ming Liu, Kun-Bin Lee, Yung-Chang Chang, Han-Liang Chou, Chin-Ming Wang, Tung-Hsing Wu, Hue-Min Lin, Yi-Hsin Huang, Chia-Yun Cheng, Ting-An Lin, Chun-Chia Chen, Yu-Kun Lin, Min-Hao Chiu, Wei-Cing Li, Sheng-Jen Wang, Yen-Chieh Lai, Ping Chao, Chih-Da Chien, Meng-Jye Hu, Peng-Hao Wang, Fu-Chun Yeh, Yen-Chao Huang, Shun-Hsiang Chuang, Lien-Fei Chen, Hsiu-Yi Lin, Ming-Long Wu, Che-Hong Chen, Ryan Chen, H.-Y. Hsu, Kevin Jou. 18.6 A 0.5nJ/pixel 4K H.265/HEVC codec LSI for multi-format smartphone applications. In 2015 IEEE International Solid-State Circuits Conference, ISSCC 2015, Digest of Technical Papers, San Francisco, CA, USA, February 22-26, 2015. pages 1-3, IEEE, 2015. [doi]
@inproceedings{JuLLCCWWLHCLCLC15,
title = {18.6 A 0.5nJ/pixel 4K H.265/HEVC codec LSI for multi-format smartphone applications},
author = {Chi-Cheng Ju and Tsu-Ming Liu and Kun-Bin Lee and Yung-Chang Chang and Han-Liang Chou and Chin-Ming Wang and Tung-Hsing Wu and Hue-Min Lin and Yi-Hsin Huang and Chia-Yun Cheng and Ting-An Lin and Chun-Chia Chen and Yu-Kun Lin and Min-Hao Chiu and Wei-Cing Li and Sheng-Jen Wang and Yen-Chieh Lai and Ping Chao and Chih-Da Chien and Meng-Jye Hu and Peng-Hao Wang and Fu-Chun Yeh and Yen-Chao Huang and Shun-Hsiang Chuang and Lien-Fei Chen and Hsiu-Yi Lin and Ming-Long Wu and Che-Hong Chen and Ryan Chen and H.-Y. Hsu and Kevin Jou},
year = {2015},
doi = {10.1109/ISSCC.2015.7063063},
url = {http://dx.doi.org/10.1109/ISSCC.2015.7063063},
researchr = {https://researchr.org/publication/JuLLCCWWLHCLCLC15},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2015 IEEE International Solid-State Circuits Conference, ISSCC 2015, Digest of Technical Papers, San Francisco, CA, USA, February 22-26, 2015},
publisher = {IEEE},
isbn = {978-1-4799-6224-2},
}