Dong Yun Jung, Hyun Gyu Jang, Doohyung Cho, Sungkyu Kwon, Jongil Won, Seong Hyun Lee, Kun Sik Park, Jong-Won Lim, Yong Ha Lee. Switching and heat-dissipation performance analysis of an LTCC-based leadless surface mount package using a power factor correction converter. In International Conference on Electronics, Information, and Communication, ICEIC 2021, Jeju, South Korea, January 31 - February 3, 2021. pages 1-3, IEEE, 2021. [doi]
Abstract is missing.