Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi. Fault detection and isolation of multiple defects in through silicon via (TSV) channel. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-5, IEEE, 2014. [doi]
@inproceedings{JungKKKKBC14,
title = {Fault detection and isolation of multiple defects in through silicon via (TSV) channel},
author = {Daniel H. Jung and Heegon Kim and Jonghoon J. Kim and Sukjin Kim and Joungho Kim and Hyun-Cheol Bae and Kwang-Seong Choi},
year = {2014},
doi = {10.1109/3DIC.2014.7152170},
url = {http://dx.doi.org/10.1109/3DIC.2014.7152170},
researchr = {https://researchr.org/publication/JungKKKKBC14},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014},
publisher = {IEEE},
isbn = {978-1-4799-8472-5},
}