TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC - researchr publication authors

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Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim. TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. Communications of the ACM, 57(1):107-115, 2014. [doi]

This author has not been identified. Look up 'Moongon Jung' in GoogleThis author has not been identified. Look up 'Joydeep Mitra' in GoogleThis author has not been identified. Look up 'David Z. Pan' in GoogleThis author has not been identified. Look up 'Sung Kyu Lim' in Google

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