Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim. TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. Communications of the ACM, 57(1):107-115, 2014. [doi]
@article{JungMPL14,
title = {TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC},
author = {Moongon Jung and Joydeep Mitra and David Z. Pan and Sung Kyu Lim},
year = {2014},
doi = {10.1145/2494536},
url = {http://doi.acm.org/10.1145/2494536},
researchr = {https://researchr.org/publication/JungMPL14},
cites = {0},
citedby = {0},
journal = {Communications of the ACM},
volume = {57},
number = {1},
pages = {107-115},
}