Morihiro Kada. Development of Functionally innovative 3D-Integrated Circuit (Dream Chip) technology / High-Density 3D-Integration Technology for Multifunctional Devices. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-6, IEEE, 2009. [doi]
@inproceedings{Kada09,
title = {Development of Functionally innovative 3D-Integrated Circuit (Dream Chip) technology / High-Density 3D-Integration Technology for Multifunctional Devices},
author = {Morihiro Kada},
year = {2009},
doi = {10.1109/3DIC.2009.5306596},
url = {http://dx.doi.org/10.1109/3DIC.2009.5306596},
researchr = {https://researchr.org/publication/Kada09},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009},
publisher = {IEEE},
}