Y. Kagawa, H. Iwamoto. 3D Integration Technologies for the Stacked CMOS Image Sensors. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
@inproceedings{KagawaI19, title = {3D Integration Technologies for the Stacked CMOS Image Sensors}, author = {Y. Kagawa and H. Iwamoto}, year = {2019}, doi = {10.1109/3DIC48104.2019.9058895}, url = {https://doi.org/10.1109/3DIC48104.2019.9058895}, researchr = {https://researchr.org/publication/KagawaI19}, cites = {0}, citedby = {0}, pages = {1-4}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, publisher = {IEEE}, isbn = {978-1-7281-4870-0}, }