STA compatible backend design flow for TSV-based 3-D ICs - researchr publication authors

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Harry Kalargaris, Yi-Chung Chen, Vasilis F. Pavlidis. STA compatible backend design flow for TSV-based 3-D ICs. In 18th International Symposium on Quality Electronic Design, ISQED 2017, Santa Clara, CA, USA, March 14-15, 2017. pages 186-190, IEEE, 2017. [doi]

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