Jungho Kang, Kyungsoo Chae, Jaeyoun Jeong. Connectivity Test for System in Package Interconnects. J. Electronic Testing, 35(4):559-565, 2019. [doi]
@article{KangCJ19,
title = {Connectivity Test for System in Package Interconnects},
author = {Jungho Kang and Kyungsoo Chae and Jaeyoun Jeong},
year = {2019},
doi = {10.1007/s10836-019-05810-2},
url = {https://doi.org/10.1007/s10836-019-05810-2},
researchr = {https://researchr.org/publication/KangCJ19},
cites = {0},
citedby = {0},
journal = {J. Electronic Testing},
volume = {35},
number = {4},
pages = {559-565},
}