Cooperative surface-activation strategy for low-temperature Cu/SiO2 hybrid bonding - researchr publication authors

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Qiushi Kang, Ge Li, Fanfan Niu, Chenxi Wang. Cooperative surface-activation strategy for low-temperature Cu/SiO2 hybrid bonding. In 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022, Xi'an, China, October 28-30, 2022. pages 40-41, IEEE, 2022. [doi]

This author has not been identified. Look up 'Qiushi Kang' in GoogleThis author has not been identified. Look up 'Ge Li' in GoogleThis author has not been identified. Look up 'Fanfan Niu' in GoogleThis author has not been identified. Look up 'Chenxi Wang' in Google

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