Qiushi Kang, Ge Li, Fanfan Niu, Chenxi Wang. Cooperative surface-activation strategy for low-temperature Cu/SiO2 hybrid bonding. In 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2022, Xi'an, China, October 28-30, 2022. pages 40-41, IEEE, 2022. [doi]
Abstract is missing.