Device performance analysis on 20nm technology thin wafers in a 3D package - researchr publication authors

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Sukeshwar Kannan, Rahul Agarwal, Arnaud Bousquet, Geetha Aluri, Hui-Shan Chang. Device performance analysis on 20nm technology thin wafers in a 3D package. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 4, IEEE, 2015. [doi]

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