Sukeshwar Kannan, Rahul Agarwal, Arnaud Bousquet, Geetha Aluri, Hui-Shan Chang. Device performance analysis on 20nm technology thin wafers in a 3D package. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 4, IEEE, 2015. [doi]
@inproceedings{KannanABAC15,
title = {Device performance analysis on 20nm technology thin wafers in a 3D package},
author = {Sukeshwar Kannan and Rahul Agarwal and Arnaud Bousquet and Geetha Aluri and Hui-Shan Chang},
year = {2015},
doi = {10.1109/IRPS.2015.7112735},
url = {http://dx.doi.org/10.1109/IRPS.2015.7112735},
researchr = {https://researchr.org/publication/KannanABAC15},
cites = {0},
citedby = {0},
pages = {4},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015},
publisher = {IEEE},
isbn = {978-1-4673-7362-3},
}