Tzu-Cheng Kao, Jian-Hsing Lee, Chen-Hsin Lien, Chih-Hsien Wang, Kuang-Cheng Tai, Hung-Der Su. Enhanced CDM-robustness for the packaged IC with the extra bonding wire to the die-attach plate. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 6, IEEE, 2015. [doi]
@inproceedings{KaoLLWTS15,
title = {Enhanced CDM-robustness for the packaged IC with the extra bonding wire to the die-attach plate},
author = {Tzu-Cheng Kao and Jian-Hsing Lee and Chen-Hsin Lien and Chih-Hsien Wang and Kuang-Cheng Tai and Hung-Der Su},
year = {2015},
doi = {10.1109/IRPS.2015.7112797},
url = {http://dx.doi.org/10.1109/IRPS.2015.7112797},
researchr = {https://researchr.org/publication/KaoLLWTS15},
cites = {0},
citedby = {0},
pages = {6},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015},
publisher = {IEEE},
isbn = {978-1-4673-7362-3},
}