Tzu-Cheng Kao, Jian-Hsing Lee, Chen-Hsin Lien, Chih-Hsien Wang, Kuang-Cheng Tai, Hung-Der Su. Enhanced CDM-robustness for the packaged IC with the extra bonding wire to the die-attach plate. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 6, IEEE, 2015. [doi]
Abstract is missing.