Jens Karrenbauer, Simon C. Klein, Sven Schönewald, Lukas Gerlach, Meinolf Blawat, Jens Benndorf, Holger Blume. SmartHeaP - A High-level Programmable, Low Power, and Mixed-Signal Hearing Aid SoC in 22nm FD-SOI. In 48th IEEE European Solid State Circuits Conference, ESSCIRC 2022, Milan, Italy, September 19-22, 2022. pages 265-268, IEEE, 2022. [doi]
@inproceedings{KarrenbauerKSGB22,
title = {SmartHeaP - A High-level Programmable, Low Power, and Mixed-Signal Hearing Aid SoC in 22nm FD-SOI},
author = {Jens Karrenbauer and Simon C. Klein and Sven Schönewald and Lukas Gerlach and Meinolf Blawat and Jens Benndorf and Holger Blume},
year = {2022},
doi = {10.1109/ESSCIRC55480.2022.9911325},
url = {https://doi.org/10.1109/ESSCIRC55480.2022.9911325},
researchr = {https://researchr.org/publication/KarrenbauerKSGB22},
cites = {0},
citedby = {0},
pages = {265-268},
booktitle = {48th IEEE European Solid State Circuits Conference, ESSCIRC 2022, Milan, Italy, September 19-22, 2022},
publisher = {IEEE},
isbn = {978-1-6654-8494-7},
}