Yusaku Katsube, Shinya Kajiyama, Takuma Nishimoto, Tatsuo Nakagawa, Yasuyuki Okuma, Yohei Nakamura, Takahide Terada, Yutaka Igarashi, Taizo Yamawaki, Toru Yazaki, Yoshihiro Hayashi, Kazuhiro Amino, Takuya Kaneko, Hiroki Tanaka. 27.6 Single-chip 3072ch 2D array IC with RX analog and all-digital TX beamformer for 3D ultrasound imaging. In 2017 IEEE International Solid-State Circuits Conference, ISSCC 2017, San Francisco, CA, USA, February 5-9, 2017. pages 458-459, IEEE, 2017. [doi]
@inproceedings{KatsubeKNNONTIY17,
title = {27.6 Single-chip 3072ch 2D array IC with RX analog and all-digital TX beamformer for 3D ultrasound imaging},
author = {Yusaku Katsube and Shinya Kajiyama and Takuma Nishimoto and Tatsuo Nakagawa and Yasuyuki Okuma and Yohei Nakamura and Takahide Terada and Yutaka Igarashi and Taizo Yamawaki and Toru Yazaki and Yoshihiro Hayashi and Kazuhiro Amino and Takuya Kaneko and Hiroki Tanaka},
year = {2017},
doi = {10.1109/ISSCC.2017.7870459},
url = {http://dx.doi.org/10.1109/ISSCC.2017.7870459},
researchr = {https://researchr.org/publication/KatsubeKNNONTIY17},
cites = {0},
citedby = {0},
pages = {458-459},
booktitle = {2017 IEEE International Solid-State Circuits Conference, ISSCC 2017, San Francisco, CA, USA, February 5-9, 2017},
publisher = {IEEE},
isbn = {978-1-5090-3758-2},
}