Hiroyuki Kawanishi, Kuniyuki Hishinuma, Masahisa Kimura, Noboru Motai, Yoshinori Soutome, Tomoyuki Tsukii, Yasuhisa Ishikawa, Toshishige Katai, Natsuki Hashiba. 64/256-Element Thermopile, Infrared Sensor Chip with 4 Built-In Amplifiers for use in Atmospheric Pressure Conditions. In 2008 IEEE International Solid-State Circuits Conference, ISSCC 2008, Digest of Technical Papers, San Francisco, CA, USA, February 3-7, 2008. pages 330-331, IEEE, 2008. [doi]
@inproceedings{KawanishiHKMSTIKH08,
title = {64/256-Element Thermopile, Infrared Sensor Chip with 4 Built-In Amplifiers for use in Atmospheric Pressure Conditions},
author = {Hiroyuki Kawanishi and Kuniyuki Hishinuma and Masahisa Kimura and Noboru Motai and Yoshinori Soutome and Tomoyuki Tsukii and Yasuhisa Ishikawa and Toshishige Katai and Natsuki Hashiba},
year = {2008},
doi = {10.1109/ISSCC.2008.4523191},
url = {http://dx.doi.org/10.1109/ISSCC.2008.4523191},
researchr = {https://researchr.org/publication/KawanishiHKMSTIKH08},
cites = {0},
citedby = {0},
pages = {330-331},
booktitle = {2008 IEEE International Solid-State Circuits Conference, ISSCC 2008, Digest of Technical Papers, San Francisco, CA, USA, February 3-7, 2008},
publisher = {IEEE},
isbn = {978-1-4244-2010-0},
}