An Active Low Input Capacitance Bond Pad for CMOS Sensor Interface Circuits

Stefan Keil, Yvonne C. Ebensberger, Roland Thewes. An Active Low Input Capacitance Bond Pad for CMOS Sensor Interface Circuits. In IEEE 8th International Workshop on Advances in Sensors and Interfaces, IWASI 2019, Otranto, Italy, June 13-14, 2019. pages 255-257, IEEE, 2019. [doi]

Abstract

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