Effect of moisture swelling on MEMS packaging and integrated sensors

J. Keller, R. Mrossko, H. Dobrinski, J. Stürmann, R. Döring, R. Dudek, S. Rzepka, B. Michel. Effect of moisture swelling on MEMS packaging and integrated sensors. Microelectronics Reliability, 53(9-11):1648-1654, 2013. [doi]

Abstract

Abstract is missing.