A. Khaled, S. Brand, M. Kögel, T. Appenroth, Ingrid De Wolf. Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis. Microelectronics Reliability, 64:336-340, 2016. [doi]
@article{KhaledBKAW16,
title = {Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis},
author = {A. Khaled and S. Brand and M. Kögel and T. Appenroth and Ingrid De Wolf},
year = {2016},
doi = {10.1016/j.microrel.2016.07.061},
url = {http://dx.doi.org/10.1016/j.microrel.2016.07.061},
researchr = {https://researchr.org/publication/KhaledBKAW16},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {64},
pages = {336-340},
}