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Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis

A. Khaled, S. Brand, M. Kögel, T. Appenroth, Ingrid De Wolf. Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis. Microelectronics Reliability, 64:336-340, 2016. [doi]

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