Rafid Adnan Khan, Saad Yousaf, Gordon W. Roberts. An In-Circuit Test Method for Measuring the Bonding Resistances of Individual IC Pins From an Interconnected Multiple IC Assembly of Flexible Hybrid Electronics. IEEE Trans. Circuits Syst. II Express Briefs, 70(3):939-943, March 2023. [doi]
@article{KhanYR23,
title = {An In-Circuit Test Method for Measuring the Bonding Resistances of Individual IC Pins From an Interconnected Multiple IC Assembly of Flexible Hybrid Electronics},
author = {Rafid Adnan Khan and Saad Yousaf and Gordon W. Roberts},
year = {2023},
month = {March},
doi = {10.1109/TCSII.2022.3219462},
url = {https://doi.org/10.1109/TCSII.2022.3219462},
researchr = {https://researchr.org/publication/KhanYR23},
cites = {0},
citedby = {0},
journal = {IEEE Trans. Circuits Syst. II Express Briefs},
volume = {70},
number = {3},
pages = {939-943},
}