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An In-Circuit Test Method for Measuring the Bonding Resistances of Individual IC Pins From an Interconnected Multiple IC Assembly of Flexible Hybrid Electronics

Rafid Adnan Khan, Saad Yousaf, Gordon W. Roberts. An In-Circuit Test Method for Measuring the Bonding Resistances of Individual IC Pins From an Interconnected Multiple IC Assembly of Flexible Hybrid Electronics. IEEE Trans. Circuits Syst. II Express Briefs, 70(3):939-943, March 2023. [doi]

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