3D-MAPS: 3D Massively parallel processor with stacked memory

Dae-Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim. 3D-MAPS: 3D Massively parallel processor with stacked memory. In 2012 IEEE International Solid-State Circuits Conference, ISSCC 2012, San Francisco, CA, USA, February 19-23, 2012. pages 188-190, IEEE, 2012. [doi]

@inproceedings{KimAHHJKKLLLLPPRSSWZKCLLL12,
  title = {3D-MAPS: 3D Massively parallel processor with stacked memory},
  author = {Dae-Hyun Kim and Krit Athikulwongse and Michael B. Healy and Mohammad M. Hossain and Moongon Jung and Ilya Khorosh and Gokul Kumar and Young-Joon Lee and Dean L. Lewis and Tzu-Wei Lin and Chang Liu and Shreepad Panth and Mohit Pathak and Minzhen Ren and Guanhao Shen and Taigon Song and Dong Hyuk Woo and Xin Zhao and Joungho Kim and Ho Choi and Gabriel H. Loh and Hsien-Hsin S. Lee and Sung Kyu Lim},
  year = {2012},
  doi = {10.1109/ISSCC.2012.6176969},
  url = {http://dx.doi.org/10.1109/ISSCC.2012.6176969},
  researchr = {https://researchr.org/publication/KimAHHJKKLLLLPPRSSWZKCLLL12},
  cites = {0},
  citedby = {0},
  pages = {188-190},
  booktitle = {2012 IEEE International Solid-State Circuits Conference, ISSCC 2012, San Francisco, CA, USA, February 19-23, 2012},
  publisher = {IEEE},
  isbn = {978-1-4673-0376-7},
}