Tightly Linking 3D Via Allocation Towards Routing Optimization for Monolithic 3D ICs - researchr publication authors

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Suwan Kim, Sehyeon Chung, Taewhan Kim, Heechun Park. Tightly Linking 3D Via Allocation Towards Routing Optimization for Monolithic 3D ICs. In Hai Helen Li, Charles Augustine, Ayse Kivilcim Coskun, Swaroop Ghosh, editors, ISLPED '22: ACM/IEEE International Symposium on Low Power Electronics and Design, Boston, MA, USA, August 1 - 3, 2022. ACM, 2022. [doi]

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