Improved reliability of copper-cored solder joints under a harsh thermal cycling condition

Yunsung Kim, Hyelim Choi, Hyoungjoo Lee, Dongjun Shin, Jinhan Cho, Heeman Choe. Improved reliability of copper-cored solder joints under a harsh thermal cycling condition. Microelectronics Reliability, 52(7):1441-1444, 2012. [doi]

Abstract

Abstract is missing.