Tae-Hyeon Kim, Tai-Hoon Cho, Young Shik Moon, Sung-Han Park. An automated visual inspection of solder joints using 2D and 3D features. In Proceedings of ThirdIEEE Workshop on Applications of Computer Vision, WACV 1996, Sarasota, FL, USA, December 2-4, 1996. pages 110-115, IEEE, 1996. [doi]
@inproceedings{KimCMP96,
title = {An automated visual inspection of solder joints using 2D and 3D features},
author = {Tae-Hyeon Kim and Tai-Hoon Cho and Young Shik Moon and Sung-Han Park},
year = {1996},
doi = {10.1109/ACV.1996.572013},
url = {http://doi.ieeecomputersociety.org/10.1109/ACV.1996.572013},
researchr = {https://researchr.org/publication/KimCMP96},
cites = {0},
citedby = {0},
pages = {110-115},
booktitle = {Proceedings of ThirdIEEE Workshop on Applications of Computer Vision, WACV 1996, Sarasota, FL, USA, December 2-4, 1996},
publisher = {IEEE},
isbn = {0-8186-7620-5},
}