Tae-Hyeon Kim, Tai-Hoon Cho, Young Shik Moon, Sung-Han Park. An automated visual inspection of solder joints using 2D and 3D features. In Proceedings of ThirdIEEE Workshop on Applications of Computer Vision, WACV 1996, Sarasota, FL, USA, December 2-4, 1996. pages 110-115, IEEE, 1996. [doi]
Abstract is missing.