Projection moire for 3D inspection of printed circuit boards

Seung-Woo Kim, Yi-Bae Choi, Jung-Taek Oh. Projection moire for 3D inspection of printed circuit boards. In Richard N. Ellson, Joseph H. Nurre, editors, Three-Dimensional Image Capture, San Jose, CA, USA, February 8, 1997. Volume 3023 of SPIE Proceedings, pages 129-138, SPIE, 1997. [doi]

@inproceedings{KimCO97,
  title = {Projection moire for 3D inspection of printed circuit boards},
  author = {Seung-Woo Kim and Yi-Bae Choi and Jung-Taek Oh},
  year = {1997},
  doi = {10.1117/12.269750},
  url = {http://dx.doi.org/10.1117/12.269750},
  researchr = {https://researchr.org/publication/KimCO97},
  cites = {0},
  citedby = {0},
  pages = {129-138},
  booktitle = {Three-Dimensional Image Capture, San Jose, CA, USA, February 8, 1997},
  editor = {Richard N. Ellson and Joseph H. Nurre},
  volume = {3023},
  series = {SPIE Proceedings},
  publisher = {SPIE},
  isbn = {978-0-8194-2434-1},
}