Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol-gel derived hybrid layers

Sanwi Kim, Taek-Soo Kim. Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol-gel derived hybrid layers. Microelectronics Reliability, 54(4):833-839, 2014. [doi]

Abstract

Abstract is missing.