Seungwon Kim, Youngmin Kim. Analysis and reduction of the voltage noise of multi-layer 3D IC with multi-paired power delivery network. IEICE Electronic Express, 14(18):20170792, 2017. [doi]
@article{KimK17-65,
title = {Analysis and reduction of the voltage noise of multi-layer 3D IC with multi-paired power delivery network},
author = {Seungwon Kim and Youngmin Kim},
year = {2017},
doi = {10.1587/elex.14.20170792},
url = {https://doi.org/10.1587/elex.14.20170792},
researchr = {https://researchr.org/publication/KimK17-65},
cites = {0},
citedby = {0},
journal = {IEICE Electronic Express},
volume = {14},
number = {18},
pages = {20170792},
}