Bong-Hwan Kim, Jong-Bok Kim, Jong-Hyun Kim. A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding. IEEE Transactions on Industrial Electronics, 56(4):1079-1085, 2009. [doi]
@article{KimKK09-7,
title = {A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding},
author = {Bong-Hwan Kim and Jong-Bok Kim and Jong-Hyun Kim},
year = {2009},
doi = {10.1109/TIE.2008.2003366},
url = {http://dx.doi.org/10.1109/TIE.2008.2003366},
researchr = {https://researchr.org/publication/KimKK09-7},
cites = {0},
citedby = {0},
journal = {IEEE Transactions on Industrial Electronics},
volume = {56},
number = {4},
pages = {1079-1085},
}