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A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding

Bong-Hwan Kim, Jong-Bok Kim, Jong-Hyun Kim. A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding. IEEE Transactions on Industrial Electronics, 56(4):1079-1085, 2009. [doi]

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