Virtual metrology for copper-clad laminate manufacturing

Misuk Kim, Seokho Kang, Jehyuk Lee, Hyunchang Cho, Sungzoon Cho, Jee Su Park. Virtual metrology for copper-clad laminate manufacturing. Computers & Industrial Engineering, 109:280-287, 2017. [doi]

Authors

Misuk Kim

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Seokho Kang

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Jehyuk Lee

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Hyunchang Cho

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Sungzoon Cho

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Jee Su Park

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