Misuk Kim, Seokho Kang, Jehyuk Lee, Hyunchang Cho, Sungzoon Cho, Jee Su Park. Virtual metrology for copper-clad laminate manufacturing. Computers & Industrial Engineering, 109:280-287, 2017. [doi]
@article{KimKLCCP17,
title = {Virtual metrology for copper-clad laminate manufacturing},
author = {Misuk Kim and Seokho Kang and Jehyuk Lee and Hyunchang Cho and Sungzoon Cho and Jee Su Park},
year = {2017},
doi = {10.1016/j.cie.2017.04.016},
url = {https://doi.org/10.1016/j.cie.2017.04.016},
researchr = {https://researchr.org/publication/KimKLCCP17},
cites = {0},
citedby = {0},
journal = {Computers & Industrial Engineering},
volume = {109},
pages = {280-287},
}