An Energy-Efficient Design of TSV I/O for HBM With a Data Rate up to 10 Gb/s

Ji-Young Kim, Taeryeong Kim, Jeonghyeok You, Ki-Ryong Kim, Byoung-Mo Moon, Kyomin Sohn, Seong-Ook Jung. An Energy-Efficient Design of TSV I/O for HBM With a Data Rate up to 10 Gb/s. J. Solid-State Circuits, 58(11):3242-3252, November 2023. [doi]

@article{KimKYKMSJ23,
  title = {An Energy-Efficient Design of TSV I/O for HBM With a Data Rate up to 10 Gb/s},
  author = {Ji-Young Kim and Taeryeong Kim and Jeonghyeok You and Ki-Ryong Kim and Byoung-Mo Moon and Kyomin Sohn and Seong-Ook Jung},
  year = {2023},
  month = {November},
  doi = {10.1109/JSSC.2023.3285896},
  url = {https://doi.org/10.1109/JSSC.2023.3285896},
  researchr = {https://researchr.org/publication/KimKYKMSJ23},
  cites = {0},
  citedby = {0},
  journal = {J. Solid-State Circuits},
  volume = {58},
  number = {11},
  pages = {3242-3252},
}