Design Quality Trade-Off Studies for 3-D ICs Built With Sub-Micron TSVs and Future Devices

Dae-Hyun Kim, Sung Kyu Lim. Design Quality Trade-Off Studies for 3-D ICs Built With Sub-Micron TSVs and Future Devices. IEEE J. Emerg. Sel. Topics Circuits Syst., 2(2):240-248, 2012. [doi]

Abstract

Abstract is missing.