Bvunarvul Kim, Seungpil Lee, Beomseok Hah, Kanawoo Park, Yongsoon Park, Kangwook Jo, Yujong Noh, Hyeon-Cheon Seol, Hyunsoo Lee, Jae-Hyeon Shin, Seongjin Choi, Youngdon Jung, SungHo Ahn, Yonghun Park, Sujeong Oh, Myungsu Kim, Seonauk Kim, HyunWook Park, Taeho Lee, Haeun Won, MinSung Kim, Cheulhee Koo, Yeonjoo Choi, Suyoung Choi, Sechun Park, Dongkyu Youn, Junyoun Lim, Wonsun Park, Hwang Hur, KiChang Kwean, Hongsok Choi, Woopyo Jeong, Sungyong Chung, Jungdal Choi, Seonyong Cha. A High-Performance 1Tb 3b/Cell 3D-NAND Flash with a 194MB/s Write Throughput on over 300 Layers $\mathsf{i}$. In IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023. pages 402-403, IEEE, 2023. [doi]
@inproceedings{KimLHPPJNSLSCJAPOKKPLWKKCCPYLPHKCJCCC23,
title = {A High-Performance 1Tb 3b/Cell 3D-NAND Flash with a 194MB/s Write Throughput on over 300 Layers $\mathsf{i}$},
author = {Bvunarvul Kim and Seungpil Lee and Beomseok Hah and Kanawoo Park and Yongsoon Park and Kangwook Jo and Yujong Noh and Hyeon-Cheon Seol and Hyunsoo Lee and Jae-Hyeon Shin and Seongjin Choi and Youngdon Jung and SungHo Ahn and Yonghun Park and Sujeong Oh and Myungsu Kim and Seonauk Kim and HyunWook Park and Taeho Lee and Haeun Won and MinSung Kim and Cheulhee Koo and Yeonjoo Choi and Suyoung Choi and Sechun Park and Dongkyu Youn and Junyoun Lim and Wonsun Park and Hwang Hur and KiChang Kwean and Hongsok Choi and Woopyo Jeong and Sungyong Chung and Jungdal Choi and Seonyong Cha},
year = {2023},
doi = {10.1109/ISSCC42615.2023.10067666},
url = {https://doi.org/10.1109/ISSCC42615.2023.10067666},
researchr = {https://researchr.org/publication/KimLHPPJNSLSCJAPOKKPLWKKCCPYLPHKCJCCC23},
cites = {0},
citedby = {0},
pages = {402-403},
booktitle = {IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023},
publisher = {IEEE},
isbn = {978-1-6654-9016-0},
}