Effects of alloying elements on microstructure and thermal aging properties of Au bonding wire

Hyung-Giun Kim, Taeg-Woo Lee, Eun-Kyun Jeong, Won-Yong Kim, Sung-hwan Lim. Effects of alloying elements on microstructure and thermal aging properties of Au bonding wire. Microelectronics Reliability, 51(12):2250-2256, 2011. [doi]

Authors

Hyung-Giun Kim

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Taeg-Woo Lee

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Eun-Kyun Jeong

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Won-Yong Kim

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Sung-hwan Lim

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