Effects of alloying elements on microstructure and thermal aging properties of Au bonding wire

Hyung-Giun Kim, Taeg-Woo Lee, Eun-Kyun Jeong, Won-Yong Kim, Sung-hwan Lim. Effects of alloying elements on microstructure and thermal aging properties of Au bonding wire. Microelectronics Reliability, 51(12):2250-2256, 2011. [doi]

Abstract

Abstract is missing.