Eungchul Kim, Seungjun Oh, Taesung Kim. Development of Eddy Current Sensor for Measuring Thickness of Copper Wafer in sub-Micron Scale. In IEEE International Workshop on Metrology for Industry 4.0 & IoT, MetroInd4.0&IoT 2021, Rome, Italy, June 7-9, 2021. pages 83-87, IEEE, 2021. [doi]
@inproceedings{KimOK21-1,
title = {Development of Eddy Current Sensor for Measuring Thickness of Copper Wafer in sub-Micron Scale},
author = {Eungchul Kim and Seungjun Oh and Taesung Kim},
year = {2021},
doi = {10.1109/MetroInd4.0IoT51437.2021.9488478},
url = {https://doi.org/10.1109/MetroInd4.0IoT51437.2021.9488478},
researchr = {https://researchr.org/publication/KimOK21-1},
cites = {0},
citedby = {0},
pages = {83-87},
booktitle = {IEEE International Workshop on Metrology for Industry 4.0 & IoT, MetroInd4.0&IoT 2021, Rome, Italy, June 7-9, 2021},
publisher = {IEEE},
isbn = {978-1-6654-1980-2},
}