Eungchul Kim, Seungjun Oh, Taesung Kim. Development of Eddy Current Sensor for Measuring Thickness of Copper Wafer in sub-Micron Scale. In IEEE International Workshop on Metrology for Industry 4.0 & IoT, MetroInd4.0&IoT 2021, Rome, Italy, June 7-9, 2021. pages 83-87, IEEE, 2021. [doi]
Abstract is missing.