Epitaxial Strain Control of HfxZr1-xO2 with Sub-nm IGZO Seed Layer Achieving EOT=0.44 nm for DRAM Cell Capacitor

Seongho Kim, Young-Keun Park, Gyu Soup Lee, Eui Joong Shin, Woon-San Ko, Hi-Deok Lee, Ga-Won Lee 0001, Byung Jin Cho. Epitaxial Strain Control of HfxZr1-xO2 with Sub-nm IGZO Seed Layer Achieving EOT=0.44 nm for DRAM Cell Capacitor. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]

@inproceedings{KimPLSKL0C23,
  title = {Epitaxial Strain Control of HfxZr1-xO2 with Sub-nm IGZO Seed Layer Achieving EOT=0.44 nm for DRAM Cell Capacitor},
  author = {Seongho Kim and Young-Keun Park and Gyu Soup Lee and Eui Joong Shin and Woon-San Ko and Hi-Deok Lee and Ga-Won Lee 0001 and Byung Jin Cho},
  year = {2023},
  doi = {10.23919/VLSITechnologyandCir57934.2023.10185400},
  url = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185400},
  researchr = {https://researchr.org/publication/KimPLSKL0C23},
  cites = {0},
  citedby = {0},
  pages = {1-2},
  booktitle = {2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023},
  publisher = {IEEE},
  isbn = {978-4-86348-806-9},
}