Chul Kim, A. M. Rassau, Stefan Lachowicz, Saeid Nooshabadi, Kamran Eshraghian. 3D-SoftChip: A Novel 3D Vertically Integrated Adaptive Computing System. In Ricardo Augusto da Luz Reis, Adam Osseiran, Hans-Jörg Pfleiderer, editors, VLSI-SoC: From Systems To Silicon, Proceedings of IFIP TC 10, WG 10.5, Thirteenth International Conference on Very Large Scale Integration of System on Chip (VLSI-SoC 2005), October 17-19, 2005, Perth, Australia. Volume 240 of IFIP, pages 71-86, Springer, 2005. [doi]
@inproceedings{KimRLNE05,
title = {3D-SoftChip: A Novel 3D Vertically Integrated Adaptive Computing System},
author = {Chul Kim and A. M. Rassau and Stefan Lachowicz and Saeid Nooshabadi and Kamran Eshraghian},
year = {2005},
doi = {10.1007/978-0-387-73661-7_6},
url = {http://dx.doi.org/10.1007/978-0-387-73661-7_6},
researchr = {https://researchr.org/publication/KimRLNE05},
cites = {0},
citedby = {0},
pages = {71-86},
booktitle = {VLSI-SoC: From Systems To Silicon, Proceedings of IFIP TC 10, WG 10.5, Thirteenth International Conference on Very Large Scale Integration of System on Chip (VLSI-SoC 2005), October 17-19, 2005, Perth, Australia},
editor = {Ricardo Augusto da Luz Reis and Adam Osseiran and Hans-Jörg Pfleiderer},
volume = {240},
series = {IFIP},
publisher = {Springer},
isbn = {978-0-387-73660-0},
}