Jin Hyun Kim, Yuhwan Ro, Jinin So, Sukhan Lee, Shinhaeng Kang, YeonGon Cho, Hyeonsu Kim, Byeongho Kim, Kyungsoo Kim, Sangsoo Park, Jin-Seong Kim, Sanghoon Cha, Won-Jo Lee, Jin Jung, Jong Geon Lee, Jieun Lee, Joon Ho Song, SeungWon Lee, Jeonghyeon Cho, Jaehoon Yu, Kyomin Sohn. Samsung PIM/PNM for Transfmer Based AI : Energy Efficiency on PIM/PNM Cluster. In 35th IEEE Hot Chips Symposium, HCS 2023, Palo Alto, CA, USA, August 27-29, 2023. pages 1-31, IEEE, 2023. [doi]
@inproceedings{KimRSLKCKKKPKCLJLLSLCYS23,
title = {Samsung PIM/PNM for Transfmer Based AI : Energy Efficiency on PIM/PNM Cluster},
author = {Jin Hyun Kim and Yuhwan Ro and Jinin So and Sukhan Lee and Shinhaeng Kang and YeonGon Cho and Hyeonsu Kim and Byeongho Kim and Kyungsoo Kim and Sangsoo Park and Jin-Seong Kim and Sanghoon Cha and Won-Jo Lee and Jin Jung and Jong Geon Lee and Jieun Lee and Joon Ho Song and SeungWon Lee and Jeonghyeon Cho and Jaehoon Yu and Kyomin Sohn},
year = {2023},
doi = {10.1109/HCS59251.2023.10254711},
url = {https://doi.org/10.1109/HCS59251.2023.10254711},
researchr = {https://researchr.org/publication/KimRSLKCKKKPKCLJLLSLCYS23},
cites = {0},
citedby = {0},
pages = {1-31},
booktitle = {35th IEEE Hot Chips Symposium, HCS 2023, Palo Alto, CA, USA, August 27-29, 2023},
publisher = {IEEE},
isbn = {979-8-3503-3907-9},
}